Infrastructure Bond Programme
Infrastructure Bond Programme
Hong Kong to Reopen RMB Bonds with Tender on July 23, 2026
HKMA to auction RMB1 billion in 3-year HKSAR Government Bonds. Interest rate set at 2.37%, tender results expected July 23.
Infrastructure Bond Programme
HKMA Announces Tender for 10-Year RMB Bonds on July 23, 2026
The HKMA will offer RMB1.25B in 10-year bonds under its Infrastructure Bond Programme, supporting Hong Kong’s offshore RMB market.
Infrastructure Bond Programme
Hong Kong Monetary Authority Announces Tender for 15-Year HKD Government Bonds
The Hong Kong Monetary Authority will tender 15-year HKD Institutional Government Bonds on December 4, 2024, under the Infrastructure Bond Programme, with an interest rate of 3.75% per annum.