Infrastructure Bond Programme
HKMA schedules RMB750 million reopening of HKSAR bond issue
HKMA will reopen issue 03GB2807001 on Oct. 22, offering RMB750 million of HKSAR institutional bonds due July 28, 2028.
Infrastructure Bond Programme
Hong Kong to Reopen RMB Bonds with Tender on July 23, 2026
HKMA to auction RMB1 billion in 3-year HKSAR Government Bonds. Interest rate set at 2.37%, tender results expected July 23.
Infrastructure Bond Programme
HKMA Announces Tender for 10-Year RMB Bonds on July 23, 2026
The HKMA will offer RMB1.25B in 10-year bonds under its Infrastructure Bond Programme, supporting Hong Kong’s offshore RMB market.
Infrastructure Bond Programme
Hong Kong Monetary Authority Announces Tender for 15-Year HKD Government Bonds
The Hong Kong Monetary Authority will tender 15-year HKD Institutional Government Bonds on December 4, 2024, under the Infrastructure Bond Programme, with an interest rate of 3.75% per annum.