According to @stocktalkweekly, TSMC Arizona has sent hundreds of engineers to Taiwan ahead of schedule to begin 2nm and 3nm process training, citing a same-day report from Taiwan’s Liberty Times as the source. source: @stocktalkweekly; Liberty Times This acceleration aligns with TSMC’s publicly stated roadmap that targets N3 expansion and N2 (2nm) volume production in 2025, indicating preparation to scale leading-edge capacity. source: TSMC Technology Symposium materials; TSMC investor communications (2023–2024) For supply-chain exposure, Amkor (AMKR) previously announced a new advanced packaging and test facility in Arizona to support chips produced at the nearby TSMC fab, and Apple disclosed it will utilize Amkor’s Arizona site for advanced packaging of Apple silicon built at TSMC Arizona—linking TSMC Arizona progress to AMKR’s back-end volumes. source: Amkor press release (Oct 2023); Apple Newsroom (Dec 2023) Crypto relevance: leading-node ramp improves performance-per-watt for compute, a dynamic TSMC highlights for N3/N2, and efficiency gains in ASIC hardware are a key cost driver for Bitcoin mining as reflected in manufacturers’ published J/TH specs—so traders in digital-asset mining and AI-infrastructure themes monitor such node and packaging milestones. source: TSMC process briefs (N3/N2 perf/W); Bitmain and MicroBT product specifications

According to @stocktalkweekly, traders are watching Amkor (AMKR) as it aligns with TSMC Arizona, Apple reshoring, and Broadcom AI chips for potential upside catalysts. Source: Stock Talk tweet dated Sep 23, 2025. Amkor is building a large advanced semiconductor packaging and test facility in Peoria, Arizona, with Apple publicly identified as the first and largest customer to package Apple-designed chips in the U.S., creating a concrete reshoring driver for volumes. Source: Amkor Technology press release dated Nov 6, 2023; Apple Newsroom announcement in Nov 2023. The Arizona plant’s ramp is intended to coincide with the phased production timeline of TSMC’s Arizona fabs, which TSMC has guided to begin production at the first facility in 2025, supporting localized back-end capacity near front-end wafer output. Source: TSMC Q1 2024 earnings commentary and U.S. CHIPS Act announcements in April 2024; Amkor Arizona project materials in 2023. Amkor discloses leading U.S. chipmakers among its customers, including Broadcom, providing exposure to advanced packaging demand tied to AI ASICs and high-performance networking cycles. Source: Amkor Technology 2023 Form 10-K customer disclosures; Broadcom FY2024 earnings commentary on AI accelerator and networking demand. For trading, key catalysts to track include construction milestones, Apple-related volume updates, any Arizona-specific revenue disclosures, and capacity additions for advanced packaging that can drive utilization, gross margin expansion, and earnings revisions. Source: Amkor investor presentations and earnings call guidance practices in 2023–2024. Crypto angle: AMKR has no direct crypto exposure, but expansions in AI chip packaging capacity have coincided with heightened volatility in AI-linked crypto tokens around major semiconductor earnings events, which cross-asset traders may monitor for sentiment spillovers. Source: Kaiko market research commentary on AI token behavior around semiconductor earnings in 2024; Amkor Technology 2023 Form 10-K indicating core business scope.